SC26: Marvell Bets on CXL and Optics for AI

Key Takeaways

1Marvell plans to showcase Photonic Fabric modules, Structera CXL memory, and Teralynx fabric at SC26

2Active electrical links of up to 1.6T and 800G will be presented

3A panel on photonics will feature Preet Virk and discuss bandwidth and power challenges

Why it matters : Marvell highlights solutions to address connectivity and memory bottlenecks in AI and HPC infrastructure.

In Chicago, Marvell plans to showcase how to connect computing and memory at the scale of AI clusters. On the agenda: photonic modules, CXL, Teralynx switching, and links up to 1.6T, as well as a panel dedicated to photonics.

Demonstrations Focused on Scale and Optical Coherence

Marvell intends to present a Photonic Fabric memory module at SC26. Active electrical cables of 1.6T and 800G using the Alaska A AEC DSP will also be displayed. A data center simulator will be based on the Teralynx T100 switch silicon, while a multipath reliable connection (MRC) demonstration will highlight the Teralynx 10. A virtual rack will bring together ODM Teralynx T100 switch trays and CXL solutions. Marvell states that its pluggable coherent modules are designed for front-end and back-end connections between data centers. According to the company, optical interconnections allow computing and memory to scale together across multiple racks, increasing the size of the scale-up domain.

Memory Segment: CXL, Structera, and DDR4/DDR5 Extensions

Marvell claims to be addressing memory limitations through innovations in CXL expansion and acceleration. Planned demonstrations include the Structera extension card, in-memory computing solutions, and expansion/compression technologies. Partners will showcase Structera X expansion controllers operating with DDR4 and DDR5 modules. Marvell also indicates it is working on unifying memory and interconnection within the same system.

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Networking: Teralynx Switching, Optics, and Electrical Interconnections

Marvell highlights its advancements in switching and interconnections to meet networking needs. According to the company, scale-out requires next-generation switches, pluggable optics, and electrical links, areas in which it continues to develop. Demonstrations will include Bravera SSD controllers and storage solutions based on the OCTEON DPU. On the fabric side, the multipath reliable connection (MRC) will be presented with Teralynx 10 silicon, and a data center simulator will be based on the Teralynx T100. Active cables at 1.6T and 800G will also be featured.

Schedule, Booth, and Talk on Photonics

SC26 will take place from November 15 to 20 at the McCormick Place convention center in Chicago, where Marvell plans to showcase technologies for scale-up, scale-out, and scale-across architectures at booth #4003. The company will participate in the Birds of a Feather session titled “Photonics for AI & HPC Clusters: Breaking the Bandwidth and Power Barrier,” featuring Preet Virk, SVP and GM of the Photonic Fabric unit, on Wednesday, November 18, from 12:15 PM to 1:15 PM in room W184bcd. Marvell has announced its participation in the event. The company is listed on NASDAQ under the symbol MRVL and claims partnerships with major tech companies for over 30 years. It states that it moves, stores, processes, and secures data through semiconductor solutions, relying on deep collaboration and transparency, with the goal of providing data infrastructure that connects the world. Marvell links these announcements to the rise in AI/HPC workloads and the connectivity and memory bottlenecks it describes.